Cryo-CMOS Electronic Circuit Design Software Package
Open tenderJapanese title: Cryo-CMOS電子回路設計用ソフトウェア一式
Overview
This tender is for the procurement of a complete software package for Cryo-CMOS electronic circuit design. Delivery deadline is August 31, 2026, with location and other conditions specified in the tender documents.
Key Details
- Source: Kanpo
- Notice type: Open tender
- Publication date: June 1, 2026
- Procuring entity: Takuya HASHIMOTO Director-Procurement Division for National Institute of Advanced Industrial Science and Technology
- Eligibility documents deadline: June 30, 2026, 12:00 JST (passed)
- Submission deadline: July 21, 2026, 17:00 JST
- Strict arrival deadline — the bid must be received by the stated time; dispatch by the deadline is not sufficient.
- Delivery deadline: August 31, 2026
- Bid opening: July 22, 2026, 14:00 JST, location: see the official notice
- Award method: Lowest-price award
- Status: Expired
- Technology relevance: Possible
- Business-action likelihood: Medium – The tender is open competitive bidding with detailed qualification requirements and a defined schedule, but local participation qualifications and language requirements may pose moderate barriers.
Official Notice
Official Source
Kanpo, Japan's official government gazette, in which legally required public procurement notices are formally published.
- Source: Kanpo, Government Procurement Notice Edition
- Official category: 入札公告 / Open competitive tender notice
- Publication date: June 1, 2026
- Publication: Kanpo, pages 29
Full English Translation
The following English translation was prepared from the original Japanese notice published in Kanpo. Where an official English summary appears in the Kanpo publication, it was used only for verification; the translation below is based on the Japanese source text.
The following general competitive tender is announced. Date: June 1, 2026. Contract Officer: Takuya HASHIMOTO, Director of the Procurement Department, National Institute of Advanced Industrial Science and Technology (AIST). Procurement agency number: 808. Location number: 08. Procurement number: 20.
1. Procurement details:
(1) Item classification numbers 71, 27.
(2) Subject and quantity: Complete software package for Cryo-CMOS electronic circuit design.
(3) Characteristics of the procurement subject: According to the tender documents and specifications.
(4) Delivery deadline: August 31, 2026.
(5) Delivery location: As specified in the tender documents.
(6) Tender method: For the subject in 1(2), a competitive tender will be conducted. The winning bid price will be the bid amount plus 10% of that amount (fractions less than 1 yen will be truncated). Bidders must state in the bid form an amount equivalent to 100/110 of the estimated contract amount regardless of tax status.
2. Eligibility for participation:
(1) Must not fall under the provisions of Articles 7 and 8 of the contract handling rules of AIST.
(2) Must be rated A, B, or C in the 'sale of goods' category according to AIST's qualification screening rules. Those with equivalent qualifications under the unified government qualification system are deemed to have the same rating.
(3) Must not be under suspension of nomination based on AIST's suspension rules during the period from this announcement to bid opening.
(4) Small and medium enterprises with technical capabilities meeting certain criteria may participate regardless of rating.
(5) Application period and place for participation qualifications: As stated in the public notice dated January 6, 2025.
3. Submission of bid forms, contract terms, distribution of tender documents, and inquiries: Address: Procurement Department, 3rd floor, Building 1-1, Group 1, Central Office, Tsukuba Center, National Institute of Advanced Industrial Science and Technology, 1-1-1 Higashi, Tsukuba City, Ibaraki Prefecture 305-8561. Contact: IKUMI HINAGATA, phone 050-3522-3405. Distribution period and method of tender documents: June 1 to June 17, 2026, at the above address. Tender briefing session: June 17, 2026, 14:30, at the same location. Deadline and place for submission of qualification documents: June 30, 2026, 12:00, same location. Bid receipt deadline: July 21, 2026, 17:00 (must arrive by this time if mailed). Bid opening: July 22, 2026, 14:00, same location.
4. Other:
(1) Language and currency for contract procedures: Japanese and Japanese yen.
(2) Bid and contract guarantees are exempted.
(3) Obligations of bidders: Bidders must submit sealed bid forms by the deadline and respond to requests for explanations before bid opening.
(4) Invalid bids: Bids from ineligible participants or those who fail obligations will be invalid.
(5) Contract document preparation is required.
(6) Award method: The bidder judged acceptable by AIST with the lowest valid bid within the price limit will be awarded.
(7) Details are in the tender documents.
Show original Japanese notice
The full Japanese notice text is temporarily hidden on this page due to a text-extraction defect. The official notice is available via the Kanpo source link on this page.
Business Signal
Business Relevance
May interest companies providing specialized electronic circuit design software, particularly for Cryo-CMOS technology.
Participation fit
Participation is expected to require appropriate Japanese government procurement eligibility, or cooperation with a suitable Japanese partner holding the required qualification. The eligibility requirements have not been fully reviewed and should be verified against the official tender documents.
This page is based on the official Kanpo tender notice, with translation and a preliminary business assessment by I.J. Do. The official Japanese notice and tender documents are binding.
JBid is a beta technology-procurement intelligence service by I.J. Do.