Expansion of Large-Capacity Memory Servers for AI Chip Design Center

Open tender

Japanese title: AIチップ設計拠点の大容量メモリサーバ増設一式

AI
About this page
This page is based on the official tender notice and presents information processed, translated, and edited by JBID.

Overview

This tender is for the expansion of large-capacity memory servers at the AI chip design center of the National Institute of Advanced Industrial Science and Technology. The contract includes supply and installation as specified in the tender documents.

Key Details

  • Source: Kanpo
  • Notice type: Open tender
  • Publication date: June 3, 2026
  • Procuring entity: Takuya HASHIMOTO, Director of Procurement Department, National Institute of Advanced Industrial Science and Technology
  • Eligibility documents deadline: July 2, 2026, 12:00 JST (passed)
  • Submission deadline: July 23, 2026, 17:00 JST
  • Strict arrival deadline — the bid must be received by the stated time; dispatch by the deadline is not sufficient.
  • Performance completion: December 18, 2026
  • Bid opening: July 24, 2026, 13:30 JST, location: see the official notice
  • Award method: Lowest-price award
  • Status: Expired
  • Technology relevance: Possible
  • Business-action likelihood: Medium – Open competitive tender with clear deadlines and no bid guarantee, but requires compliance with specific qualification ratings and local submission, suggesting moderate barriers.

Official Notice

Official Source

Kanpo, Japan's official government gazette, in which legally required public procurement notices are formally published.

  • Source: Kanpo, Government Procurement Notice Edition
  • Official category: 入札公告 / Open competitive tender notice
  • Publication date: June 3, 2026
  • Publication: Kanpo, pages 17

Full English Translation

The following English translation was prepared from the original Japanese notice published in Kanpo. Where an official English summary appears in the Kanpo publication, it was used only for verification; the translation below is based on the Japanese source text.

Tender Notice:
The following general competitive tender is announced. Date: June 3, 2026. Contract officer: Takuya HASHIMOTO, Director of Procurement Department, National Institute of Advanced Industrial Science and Technology. Procurement agency number: 808. Location number: 08. Procurement number: 19.
1. Item classification number:
24.
2. Subject and quantity:
Expansion of large-capacity memory servers for the AI chip design center.
3. Characteristics of procurement subject:
According to the tender documents and specifications.
4. Performance deadline:
December 18, 2026.
5. Performance location:
As stated in the tender documents.
6. Tender method:
The subject in 1(2) will be tendered. The winning bid price will be the bid amount plus 10% of that amount (fractions less than 1 yen will be truncated). Bidders must state in the bid form an amount equivalent to 100/110 of the estimated contract amount regardless of tax status. Eligibility: Bidders must not fall under disqualifications per Articles 7 and 8 of the contract handling rules of the National Institute of Advanced Industrial Science and Technology. Bidders must be rated A, B, or C for 'sale of goods' per the qualification review rules. Those with equivalent qualifications under the unified qualification system are deemed qualified. Bidders must not be under suspension based on the institute's suspension rules during the tender period. Technologically capable small and medium enterprises meeting certain criteria may participate regardless of rating. Application timing and place for participation qualifications are as published on January 6, 2025. Submission place for bid forms, contract terms, and inquiries: National Institute of Advanced Industrial Science and Technology, Tsukuba Center, 1-1-1 Higashi, Tsukuba City, Ibaraki 305-8561, Procurement Department, Procurement Section 2, 3rd floor, Building 1 Group 1-1, contact: KAZUKI Nemoto, phone 050-3522-4210. Tender documents available from June 3 to June 17, 2026. No briefing session will be held. Deadline for submission of required documents: July 2, 2026, 12:00. Bid receipt deadline: July 23, 2026, 17:00 (must arrive by then if mailed). Opening date and place: July 24, 2026, 13:30, same address, 3rd floor, bid room. Language and currency: Japanese and Japanese yen. No bid or contract guarantee required. Bidders must submit sealed bids by the deadline and respond to explanations if requested before bid opening. Invalid bids include those from unqualified bidders or those failing obligations. Contract document required. Award method: The institute will select the bidder judged acceptable within the price limit based on the lowest valid bid. Details in tender documents.
Show original Japanese notice

The full Japanese notice text is temporarily hidden on this page due to a text-extraction defect. The official notice is available via the Kanpo source link on this page.

Business Signal

Business Relevance

May interest companies providing large-capacity memory server hardware and integration services for AI chip design environments.

Participation fit

Participation is expected to require appropriate Japanese government procurement eligibility, or cooperation with a suitable Japanese partner holding the required qualification. The eligibility requirements have not been fully reviewed and should be verified against the official tender documents.

This page is based on the official Kanpo tender notice, with translation and a preliminary business assessment by I.J. Do. The official Japanese notice and tender documents are binding.

JBid is a beta technology-procurement intelligence service by I.J. Do.

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